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HVIC technology enables ruggedized monolithic con. Temperature 75 The Thermal Dwtasheet and Power Dissipation ratings are measured. Amplifier Low Level Output vs. Amplifier Input Offset vs. Typical ratings at other bias conditions are shown in Figure Output Sink Current vs. Typical ratings at other bias conditions are shown in Figure High Side Floating Offset Voltage.
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Common Mode Rejection Ratio Op. Amplifier Slew Rate – vs. Gate drive supply range from 10 to 20V. Typical ratings at other bias conditions are shown in Figure Propagation delays are matched. Offset Supply Leakage Current vs. Turn-On Rise Time vs. Deadtime Waveform Definitions 6. High Side Floating Output Voltage.
Turn-On Rise Time vs. Voltage 80 80 Typ. Diagnostic Feedback Operational Amplifier Circuit www.
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Output Source Current vs. High Level Output vs. The dynamic electrical characteristics are defined in Figures 3 through 5. Units Test Conditions 11 12 13 14 15 — 16 — 17 18 18 19 20 — — — — 6. Amplifier Output Sink Current vs.
For proper operation the device should be used within the. Lead Temperature Soldering, 10 seconds. Temperature IR 20 8. Offset Supply Leakage Current vs. A current trip function which terminates all six outputs is also de- rived from this resistor.
Overcurrent Shutdown Switching Time. Voltage 40 20 60 Typ. Date code Pin 1 Identifier? Output Sink Current 47 1. The output drivers feature a high pulse current buffer stage designed for minimum driver cross-conduction.
Typical Connection Refer to Lead Assignments for correct pin configuration. Amplifier Input Offset vs. Low Side Output Voltage. High side gate drive outputs. Output Source Kr2132 Op.